Empowering Semiconductor Innovation: Building the Connected Future of Tomorrow

The semiconductor industry is experiencing exponential growth, driven by advancements in artificial intelligence, high-performance computing, and the ever-growing demand for connected devices. As this industry continues to expand, it is also confronted with an array of challenges—from the increasing complexity of component designs to stricter requirements for contamination control, process reliability, and cost efficiency. To stay competitive, manufacturers must navigate a dynamic landscape where precision, material performance, and scalability are paramount.

According to industry forecasts, the semiconductor market is expected to reach unprecedented growth levels, making it a crucial area for innovation and investment. However, this rapid evolution also underscores the need for robust, reliable solutions that address the unique demands of modern semiconductor manufacturing processes.

The Need for Enhanced Surface Solutions in Semiconductor Manufacturing

As chip designs become more sophisticated, manufacturers are under pressure to meet higher performance standards and reduce defect rates while maintaining production efficiency. The trend toward smaller chip sizes, now pushing below 2 nm, brings unique challenges, such as the need for coatings that offer low particle counts, superior corrosion resistance, and minimized contamination. Traditional thermal spray methods are no longer sufficient for meeting these stringent demands. Instead, thin-film solutions such as Physical Vapor Deposition (PVD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) coatings have become increasingly critical.

The primary pain points for semiconductor producers include:

• Reducing Defect Density: As chips shrink, even the smallest particle can cause significant defects. Manufacturers need coatings that minimize particle contamination and provide smooth, dense layers to prevent costly failures.
• Increasing Equipment Uptime: With high capital investments, maximizing equipment utilization is essential. Enhanced coating solutions can extend component lifetimes, reduce the frequency of maintenance, and lower the overall cost of ownership.
• Improving Chemical and Plasma Resistance: Modern semiconductor processes often involve aggressive chemicals and plasmas that can degrade unprotected components. Solutions that resist chemical corrosion and plasma damage are key to maintaining high yields and process stability.

Oerlikon's Comprehensive Surface Solutions for the Semiconductor Industry

Oerlikon addresses these challenges by offering a wide range of advanced surface solutions that improve performance, durability, and reliability across various semiconductor applications. Our expertise in PVD, PECVD, thermal spray technologies and additive manufacturing allows us to provide targeted solutions for critical components, including electrostatic chucks, chamber liners, showerheads, and wafer handling systems. These offerings deliver several benefits:

PVD and PECVD Coatings for Advanced Semiconductor Manufacturing

Our thin-film coatings, such as BALINIT® DYLYN and BALINIT® DLC, are designed to reduce particle generation, enhance wear resistance, and provide exceptional chemical stability. This is particularly vital for components exposed to aggressive etching processes or where maintaining cleanliness is a top priority. By lowering defect densities and enhancing component longevity, these coatings ensure consistent high yields even as geometries shrink.

Thermal Spray Solutions for Enhanced Durability and Corrosion Resistance

Our thermal spray guns are the premier solution for applying our high-quality powders in semiconductor applications. Engineered for precision and reliability, these guns deliver coatings with excellent adhesion and minimal porosity, making them ideal for critical components exposed to corrosive environments. By using our advanced thermal spray technology, manufacturers can protect chamber parts, heater plates, and shields, enhancing component longevity and reducing contamination risks.

Additive Manufacturing for Next-Generation Component Design

Additive manufacturing (AM) enables the creation of complex geometries that optimize thermal management and fluid flow in semiconductor equipment. This technology is revolutionizing the design and production of components like cooling manifolds and gas delivery systems, offering enhanced functionality, reduced weight, and improved thermal performance.

By combining these capabilities, Oerlikon delivers a holistic approach to surface engineering that not only improves component performance but also contributes to overall process efficiency and sustainability.